Envié una solicitud electrónica. El proceso duró 3 semanas. Acudí a una entrevista en Roche (Branford, CT) en jun 2011
Entrevista
I was contacted by the Manufacturing Manager for a phone interview. Scheduling was easy via email. We talked for between an hour and an hour and a half. Conservation went very well, I was actually told I was in the top 3 candidates for the position of the resumes they had received. I was asked several questions about previous projects and described my experiences. At the end of the conservation I was left with the impression that an on-site interview would occur in the next week. After two followup emails and 2 weeks, I was informed that 2 other applicants had been selected for the next interview.
Envié una solicitud electrónica. Acudí a una entrevista en Roche (Marlborough, MA) en oct 2015
Entrevista
Phone interview followed by an in person interview with two engineers and director of operations. They asked me about my background as it related to the position I was applying for. They also wanted to get a feeling for my personality and see if I was a fit with the culture.
Preguntas de entrevista [1]
Pregunta 1
Overview of my background and what I could bring to the organization.
Envié una solicitud electrónica. El proceso duró 2 semanas. Acudí a una entrevista en Roche (Indianapolis, IN) en mar 2014
Entrevista
Contacted by Administrative Assistant 2 months after submitting online resume for a Manufacturing Engineering Position. Invited on-site for one-on-one interview with Engineering Manager. Manager was very professional and spent 45 minutes asking questions and then 30-45 minutes for a tour. Standard interview questions, no surprises. Invited back within a week for a panel Interview with 3 leads and another 30 minutes with the Engineering Manager. Manager was savvy about getting me out of standard answer formats and trying to challenge my soft skills.
Preguntas de entrevista [1]
Pregunta 1
Manager asked me to sell him a bottle of water to check soft skills and how I thought on my feet.
