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      Búsquedas relacionadas: Opiniones sobre Intel Corporation | Ofertas de empleos en Intel Corporation | Sueldos en Intel Corporation | Beneficios en Intel Corporation
      Entrevistas de Intel CorporationEntrevistas para el puesto de Senior Packaging Engineer en Intel CorporationEntrevista de Intel Corporation


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      Entrevista de Senior Packaging Engineer

      17 jul 2015
      Candidato de entrevista anónimo
      Phoenix, AZ
      Sin oferta
      Experiencia neutra
      Entrevista normal

      Solicitud

      Envié una solicitud electrónica. El proceso duró 2 semanas. Acudí a una entrevista en Intel Corporation (Phoenix, AZ) en jun 2015

      Entrevista

      Phone Interview, Followed by on-site, The whole process took 2 weeks. The onsite interview included 7 interviews in total, one after the other in a very busy schedule. They also ask me to do a one hour interview about my research. The interviewers were nice and friendly but the whole thing felt rush.

      Preguntas de entrevista [1]

      Pregunta 1

      Tell me about your research
      Responder pregunta

      Otras opiniones sobre las entrevistas para el puesto de Senior Packaging Engineer en Intel Corporation

      Entrevista de Senior Packaging Engineer

      11 feb 2019
      Candidato de entrevista anónimo
      Chandler, AZ
      Sin oferta
      Experiencia positiva
      Entrevista normal

      Solicitud

      Solicité el puesto a través de la escuela superior o la universidad. El proceso duró 4 semanas. Acudí a una entrevista en Intel Corporation (Chandler, AZ) en dic 2018

      Entrevista

      I interviewed with two teams back-to-back. The first team was Materials Technology Development with whom I interviewed from 8am-2pm including 1 hr of lunch in between. There was no presentation and all the interviews which lasted from 30 minutes- 1hr were focused on my PhD research. There was one technical round in which I was asked questions related to stresses in packaging. The second team was Module engineering with whom I interviewed from 2pm - 6pm including first 1 hour of my presentation. The questions in all the interviews from this team were completely behavioral.

      Preguntas de entrevista [1]

      Pregunta 1

      How do you deal with stress? (Module Engineering)
      Responder pregunta

      Entrevista de Senior Packaging Engineer

      6 nov 2015
      Candidato de entrevista anónimo
      Chandler, AZ
      Sin oferta
      Experiencia negativa
      Entrevista difícil

      Solicitud

      Envié una solicitud electrónica. El proceso duró 1 día. Acudí a una entrevista en Intel Corporation (Chandler, AZ) en jul 2015

      Entrevista

      Onsite interview. But they never sent me an agenda. So on the interview day, I didn't even know when I would give a presentation or who would interview me or how many people I would expect to talk to. The interview started with one on one interview. (strange, isn't it?) After I interviewed with all managers and director, my host took me to another building to interview with VP. But VP didn't show up. So my host took me back and then I gave an 1 hour presentation to 3 people (my host, a manager and my HM). The manager asked me a lot of unrelated background questions. I don't work in that area. I don't know all the answers. But he kept asking even I told him I was not working in that area. HM was not even listening. Her computer had some problems that she could not even login. So she was dealing with that computer all time long till the end of my presentation. Very unprofessional! After I came back, I sent a thank you letter to everyone, but didn't hear back. After 4 weeks, I sent out a followup to HM, and didn't hear back. Another week later, I received a rejection email sent by the application system.

      Preguntas de entrevista [1]

      Pregunta 1

      What is enthalpy
      Responder pregunta
      1

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