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      Búsquedas relacionadas: Opiniones sobre Intel Corporation | Ofertas de empleos en Intel Corporation | Sueldos en Intel Corporation | Beneficios en Intel Corporation
      Entrevistas de Intel CorporationEntrevistas para el puesto de PACKAGING R&D ENGINEER en Intel CorporationEntrevista de Intel Corporation


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      Entrevista de PACKAGING R&D ENGINEER

      4 nov 2019
      Candidato de entrevista anónimo
      Chandler, AZ

      Otras opiniones sobre las entrevistas para el puesto de PACKAGING R&D ENGINEER en Intel Corporation

      Entrevista de PACKAGING R&D ENGINEER

      27 abr 2022
      Empleado anónimo
      Oferta aceptada
      Experiencia positiva
      Entrevista normal
      Sin oferta
      Experiencia neutra
      Entrevista normal

      Solicitud

      Solicité el puesto a través de la escuela superior o la universidad. El proceso duró 1 día. Acudí a una entrevista en Intel Corporation (Chandler, AZ) en sept 2019

      Entrevista

      I applied through my University's job application portal: Handshake and was called the next day for a phone screen directly by the Hiring Manager. After a week, I was invited on-site at Intel, Chandler for a day-long interview. It was scheduled from 9 am to 5 pm, meeting 1:1 with 2 mechanical engineering team leads and 3 senior engineers with several breaks in between. There were 4 other candidates interviewing that day. The 1:1 interviews were a mix of behavioral and technical questions, mostly asking about my previous experiences and things on my resume. The technical questions were mechanical engineering-related: stress-strain curve, heat transfer, CTE, DOE, Statistical Analysis, DFM, Structural Mechanics, FEA and injection molding. Most of the questions were testing problem-solving ability and how one thinks out of the box. The last 1 hour was scheduled for a Solidworks test, in which, I was given an isometric view of a tool holder to be designed as a 3D model, followed by assembly and 2D drafting and dimensioning. Ask several questions along the way, if you get stuck, ask. The design test was really interesting and was geared to test one's comfort with Solidworks, how one dimensions, and the use of correct steps to achieve an efficient output (Least number of clicks and keystrokes). Negatives: It was a great experience overall, everyone there was positive and cheerful. However, after the interview, it took them 1 month to send a rejection email, that too an automated one with no feedback. When asked for feedback, no one replied. I was asked to fill out a reimbursement form to cover the travel for the interview, but, never got the reimbursement. Not that I care about the reimbursement, but no feedback is very unprofessional.

      Preguntas de entrevista [7]

      Pregunta 1

      What is CTE Mismatch? How can it be avoided?
      Responder pregunta

      Pregunta 2

      Draw and explain the Stress-Strain curve.
      Responder pregunta

      Pregunta 3

      Draw and explain an SFD and BMD for a simply supported beam.
      Responder pregunta

      Pregunta 4

      What is Root Cause Analysis and explain your project?
      Responder pregunta

      Pregunta 5

      Given the choice of Flathead and Philips head screw, which would you select? What are the advantages and disadvantages of both?
      Responder pregunta

      Pregunta 6

      What are some DFM considerations when designing for Injection Molding?
      Responder pregunta

      Pregunta 7

      Which material would you select if the product needs to have a high cosmetic value, needs to be hard and have the ability to withstand constant thermal cycling?
      Responder pregunta
      1

      Solicitud

      Envié una solicitud electrónica. Acudí a una entrevista en Intel Corporation

      Entrevista

      The team was very friendly but asked keen questions from my resume. The hiring manager mostly asked questions about my fit for the position. Very constructive interview with lots of learning.

      Preguntas de entrevista [1]

      Pregunta 1

      What exactly do you expect for this role?
      Responder pregunta

      Entrevista de PACKAGING R&D ENGINEER

      28 feb 2022
      Empleado anónimo
      Oferta aceptada
      Experiencia positiva
      Entrevista normal

      Solicitud

      Acudí a una entrevista en Intel Corporation

      Entrevista

      Initial phone call interview, was described the position and asked a few questions relating to knowledge of polymer science and instrumental analysis. Then was allowed to ask a few questions back to the interviewer.

      Preguntas de entrevista [1]

      Pregunta 1

      Strengths and weaknesses? Describe an instrument, how it functions?
      Responder pregunta

      Entrevista de PACKAGING R&D ENGINEER

      22 feb 2022
      Empleado anónimo
      Oferta aceptada
      Experiencia positiva
      Entrevista normal

      Solicitud

      Acudí a una entrevista en Intel Corporation

      Entrevista

      1. 1 st round is a 30 min phone screening 2. 2nd round is an 1h presentation on research and nine 1:1 sessions. most questions are about presentation. also ask a lot of behavior questions.

      Preguntas de entrevista [1]

      Pregunta 1

      1. why do you want this job
      Responder pregunta