Instantánea de TSMC
* Vision
Our vision is to be the most advanced and largest technology and foundry services provider to fabless companies and IDMs, and in partnership with them, to forge a powerful competitive force in the semiconductor industry.
To realize our vision, we must have a trinity of strengths:
- Be a technology leader, competitive with the leading IDMs
- Be the manufacturing leader
- Be the most reputable, service-oriented and maximum-total-benefits silicon foundry
* Mission
Our mission is to be the trusted technology and capacity provider of the global logic IC industry for years to come.
Our vision is to be the most advanced and largest technology and foundry services provider to fabless companies and IDMs, and in partnership with them, to forge a powerful competitive force in the semiconductor industry.
To realize our vision, we must have a trinity of strengths:
- Be a technology leader, competitive with the leading IDMs
- Be the manufacturing leader
- Be the most reputable, service-oriented and maximum-total-benefits silicon foundry
* Mission
Our mission is to be the trusted technology and capacity provider of the global logic IC industry for years to come.
TSMC (TWSE: 2330, NYSE: TSM) created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2022, TSMC served 532 customers and manufactured 12,698 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics.
Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 15 million 12-inch equivalent wafers in 2022. These facilities include four 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as one 12-inch wafer fab at a wholly owned subsidiary, TSMC Nanjing Company Limited, and two 8-inch wafer fabs at wholly owned subsidiaries, WaferTech in the United States and TSMC China Company Limited.
In December 2022, TSMC announced that, in addition to TSMC Arizona’s first fab, which is scheduled to begin production of N4 process technology in first half of 2025, the Company has also started the construction of a second fab which is scheduled to begin production of 3nm process technology in 2026. At the same time, the Company continues to execute its plan for a fab in Kumamoto, Japan, with production targeted by late 2024.
Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 15 million 12-inch equivalent wafers in 2022. These facilities include four 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as one 12-inch wafer fab at a wholly owned subsidiary, TSMC Nanjing Company Limited, and two 8-inch wafer fabs at wholly owned subsidiaries, WaferTech in the United States and TSMC China Company Limited.
In December 2022, TSMC announced that, in addition to TSMC Arizona’s first fab, which is scheduled to begin production of N4 process technology in first half of 2025, the Company has also started the construction of a second fab which is scheduled to begin production of 3nm process technology in 2026. At the same time, the Company continues to execute its plan for a fab in Kumamoto, Japan, with production targeted by late 2024.
