Solicité el puesto a través de la escuela superior o la universidad. El proceso duró 1 día. Acudí a una entrevista en Solvent Software Solutions (Bāpatla) en oct 2015
Entrevista
First of all,there is a written examination consisting of 20 questions in which 15 questions are based on aptitude and to solve all these 15 questions ,we want a good basic knowledge,formulas etc and remaining 5 questions [both theory and programs] are based on Basics of c,c++,java.And one should want to see the TIME and they gave only 30 minutes .
With a span of 30 minutes , results were announced in which out of 500 students only 40 are selected....and i am one of it by GOD grace..
Then i was called for GD and gave 2 topics like IMPORTANCE OF IT AND WHY U ARE COMING TO THIS RATHER THAN OTHER...............and another topic NEW CAPITAL amaravathi.
And i was selected only 16 were selected and called for interview.
Preguntas de entrevista [1]
Pregunta 1
All are basics of our core and programming languages
Envié una solicitud electrónica. El proceso duró 1 día. Acudí a una entrevista en Solvent Software Solutions (Hyderabad) en nov 2015
Entrevista
- a simple telephone interview basis application on an online job advert.
- Was asked to come in for an face-to-face interview same day.
- a basic discussion with the HR that didn't involve any technical questions.
- No technical exam or interview round.
- a demo to a room full of people who themselves are new to the technology.
- Got a call back 3 days later offering me a part time position as they were not in a position to meet my salary expectations for a full-time role
Solicité el puesto a través de la recomendación de un empleado. Acudí a una entrevista en Solvent Software Solutions en jul 2012
Entrevista
written test mainly on aptitude,basics of c language and next round is face to face interview.after clearing the f2f round hr round will be there.mainly they will discuss on general things like why do you want to join in our company,what is your salary expectation and what is your preferred location and regarding bond period
