Envié una solicitud electrónica. El proceso duró 2 semanas. Acudí a una entrevista en Shin-Etsu Handotai (Livingston, Scotland) en mar 2024
Entrevista
Interviewed by the technical John Anderson and Billy Scott. The QA and technical team lead. It is important to understand the silicone wafer process form grinding to the polishing process. A presentation has to be done in person for the 2nd round if you pass the 1st round.
Preguntas de entrevista [1]
Pregunta 1
How do you see yourself in the organisation in the coming 10 years? A more leadership role in the technical department, a more hands on engineer or a customer relations engineer?
Friendly in person interview with standard interview questions. Second interview with aptitude test and plant tour. Not too much of a challenge if you prepare appropriately. Presentation required to demonstrate communication skills, topic can be selected by applicant.
Preguntas de entrevista [1]
Pregunta 1
Explain the method for tackling a complex engineering problem.