The interview process consisted of one phone screening of an hour following with two onsite interviews of 4 hours approximately. The position was for NCG with majorly dealing in finding solutions for PCBs of obsolete legacy KLA products. Phone screening is basically the hiring manager explaining job responsibilities and your willingness for that job role There were two onsite interviews because they want you to meet with each and every member of the group (8 members and the hr) They had asked me to give a technical presentation on a topic falling under Hardware Applications System for 30mins. I gave a presentation on one of my Academic project from SJSU which was about designing a Network on Chip Bus for a Cyclic Check Redundancy module. I would suggest choosing such topics on which you have worked hands on. This helps in all the cross questioning during the presentation and displays your efforts in the project. The first onsite interview along-with the presentation had a tour of the laboratory where the silicon inspection tools were kept followed by interviews with three members of the team. These round of interviews were more based on skills and projects listed in your resume and some basic electrical circuitry concepts. Once you clear the first round they ask to meet the remaining members of the team. In my case, there were three interviewers. This was more technical than the first on-site, focusing on PCB concepts, basic electrical and electronics concepts and how could you fit in the team (contribute to the team). Second onsite

The process took about 3-4 weeks. I responded to a job posting and the manager considered my Resume for further interviews. the interview rounds consisted of: 1) An initial phone screening with the member of the team to understand more about the role and where my interest lies. After that a 30 minute phone interview with the team manager where he asked me about my academic projects and internship work experience and explained me what work the team does. Following that was a 45 minute interview with the Team Director where I was asked technical questions related to my projects and some more technical questions related to Verilog, CDC issues. Lastly, there was a technical interview with another manager where he asked me in-depth questions about metastability, CDC issues, FIFO Depth calculation, design of synchronous and Asynchronous FIFO. Everyone made me comfortable during the interviews and helped me as well in some areas. Few days after the final interview, I received an offer which I gladly accepted.