There were two technical rounds in the interview process. The team director participated in the first round. The interview focused more on the fabrication side and covered previous projects, experiences/jobs, software experiences, and the fundamental technical knowledge needed for the position. Second round involved a different team lead and was centered on circuit principles, equations, etc.

First, HR reached out to me through a call, scheduling me for an initial interview with the hiring manager. Then after initial interview, final interview with the senior hiring manager. After passing two interviews, they will give you a job offer. It all happened in the span of 1 week