Solicité el puesto a través de la escuela superior o la universidad. El proceso duró 3 días. Acudí a una entrevista en Texas Instruments (Bengaluru) en jul 2021
Entrevista
The interview was good. The started with rond 1 with 20 digital questions for 45 mins. It contains basics of digital like shift registers and VLSI. 2nd round started with RC circuits and some more basics of CMOS and in round 2 they test us with some basics of digital.
Solicité el puesto a través de la escuela superior o la universidad. El proceso duró 1 semana. Acudí a una entrevista en Texas Instruments (Bengaluru) en jul 2025
Entrevista
This is a part of On campus recruitment
First they Conducted ppt, then online test where we can select 2 domains
Each domain consists of 20 questions, 45 min each and an extra aptitude section
Preguntas de entrevista [1]
Pregunta 1
Started off with my intro
Then asked about my projects, later moved on to technical questions that basically covered digital signal processing, frequency divider circuits, FFT, applications of 2's complement and gray code representation
Acudí a una entrevista en Texas Instruments (Bengaluru)
Entrevista
Two rounds, one technical and one HR round. Technical round lasted for about one hour which consisted of questions related to fpga working, cache coherence, digital logic design, verilog and vhdl, STA and questions related to projects mentioned in my resume.
Preguntas de entrevista [1]
Pregunta 1
Started with basic digital electronics questions like logic design(also included equivalent verilog code), counters then moved to STA and physical design. Later on questions on cache memory were asked. I had done a project on asynchronous fifo so I had to explain that. Finally few basic questions related to fpga.
Solicité el puesto a través de la escuela superior o la universidad. Acudí a una entrevista en Texas Instruments (Bengaluru)
Entrevista
First exam clear that than interview process, it is moderate to hand level
You have to prepare very well then they will hire otherwise do not apply.. . . . .
