The first part of the process was a Recruiter on the phone, then they organized thru another person to have a meeting with the hiring manager over video call, then second round interview with panel
Preguntas de entrevista [1]
Pregunta 1
tell me about yourself? Why do you think we should hire you?
Long interview process. Lots of technical questions about projects you've worked on, very technical questions.
1 ] Screening phone call interview
2 ] Technical phone call interview
3 ] Technical Presentation
4 ] Technical in Person interview
Preguntas de entrevista [1]
Pregunta 1
list a type of precision locating mechanisms and whats the benefit of some over others.
Envié una solicitud electrónica. El proceso duró 4 semanas. Acudí a una entrevista en KLA (Milpitas, CA) en oct 2021
Entrevista
The HR team reached out through phone and arranged an interview with the HM. After that I had to do a presentation and 1on1 interviews. People were nice and smart.
There was nothing horrendous in the interviews if you were an experienced professional. However, tbh, job description contained less than 5% of what they were looking for. There were few things that even the hiring team had no knowledge/experience with but they still asked for it. When I asked that the range of knowledge they are asking for is interestingly broad they said they didn't expect people to know everything! At the end, I got to know that they have encountered an extremely nonlinear problem with aggressive BCs which they were looking for to solve but I didn't get the vibe that they were interested in hiring someone to solve it but looking for someone who can tell them how to solve such problem.
I got rejected after 8 interviews cause I didn't match the profile they looked for but I wouldn't have applied for this position in the first place if the job description was clear from the beginning! HR team refused to provide me any feedback referring to the company policy.
Preguntas de entrevista [7]
Pregunta 1
Anything you can imagine on very detailed FEA subjects: structural and thermal.