Envié una solicitud electrónica. El proceso duró 4 semanas. Acudí a una entrevista en Apple (San Francisco, CA) en nov 2019
Entrevista
There were three phone screens and then an on-site interview. Questions weren't that hard. The group design review is extremely difficult. If you can get friends to review your design of something. Have them interrupt you, graph stuff, question you, etc.
Preguntas de entrevista [1]
Pregunta 1
Basic mechanics, thermal propgation from GPU and CPU, Spatial awareness questions (like how do you know that this door opens outward?), and more
The interview went well overall. The interviewer opened with a discussion about a project I'm proud of, then a beam scenario question that covered structural and load analysis, stress and deflection, and material selection — testing my ability to connect first-principles thinking across the full problem space.
Solicité el puesto a través de la escuela superior o la universidad. Acudí a una entrevista en Apple (Cupertino, CA) en abr 2026
Entrevista
Interview with hiring manager then virtual onsite. They ask you general mechanical engineering questions as well as questions dependent on type of team and skills they are looking for. Not bad overall just brush up on basic beam deflection, GD&T, Design analysis etc.
They gave me a take home tolerance analysis worksheet. It was essentially a tolerance stack up for one of their products and felt fairly straight forward. Thought I answered it well but ultimately they decided to move forward with other candidates.